KHP®7025 R760: High-Performance CuNi3SiMg Alloy with Superior Conductivity and Strength
KHP®7025 is a CuNiSi (Corson type) alloy. KHP®7025 provides a high electrical conductivity combined with high strength and good resistance against stress-relaxation.
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 8.8 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Bendability 180°, bw | 23.0 °C | 2.5 [-] | |
Bendability 180°, gw | 23.0 °C | 2.5 [-] | |
Bendability 90°, bw | 23.0 °C | 1.5 [-] | |
Bendability 90°, gw | 23.0 °C | 2 [-] | |
Elastic modulus | 23.0 °C | 130 GPa | |
Elongation A50 | 23.0 °C | 7 % | min. |
Tensile strength | 23.0 °C | 760 - 860 MPa |
Thermal
| Property | Temperature | Value |
|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.7E-5 1/K |
Thermal conductivity | 23.0 °C | 190 W/(m·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 23.0 °C | 2.30E+7 - 2.90E+7 S/m |
Specific Electrical conductivity | 40 - 50 % IACS |
Chemical properties
| Property | Value |
|---|---|
Copper | balance |
Magnesium | 0.05 - 0.3 % |
Nickel | 2.2 - 4.2 % |
Silicon | 0.25 - 1.2 % |
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