Renesas Launches Low‑Power, High‑Performance Entry‑Level RA2E1 MCUs

Renesas has unveiled the RA2E1 family of entry‑level microcontrollers, designed for cost‑sensitive and space‑constrained systems that demand both high performance and ultra‑low energy consumption.

Built around a 48‑MHz Arm Cortex‑M23 core, each RA2E1 MCU integrates up to 128‑KB of code flash and 16‑KB of SRAM on a single chip. The new lineup comprises 48 devices, supporting an operating voltage range of 1.6 V to 5.5 V and offering a wide selection of packages—including LQFP, QFN, LGA, BGA and wafer‑level chip‑scale package (WLCSP) as small as 2.14 × 2.27 mm.

These devices deliver a balanced mix of performance, efficiency and rich functionality. Renesas reports that the RA2E1’s low‑power design extends to every on‑chip peripheral, the flash memory and SRAM, enabling the smallest possible power draw across the full temperature and voltage spectrum. With multiple low‑power modes, designers can tailor power consumption to meet the needs of diverse applications.

Benchmarking against the EEMBC ULPMark suite, the RA2E1 achieved a score of 321 at 1.8 V—verifying its best‑in‑class energy efficiency. When in active mode, the MCU consumes 100 µA / MHz, and in software standby it drops to just 250 nA, allowing near‑standby power usage during critical operations.

Beyond raw performance, the RA2E1 offers an upgrade path with hardware and software scalability, positioning it as a natural entry point into Renesas’ broader RA family.

Key Features

• 48 MHz Arm Cortex‑M23 CPU core
• Flash memory options from 32 KB to 128 KB; 16 KB SRAM
• Operating voltage: 1.6 V – 5.5 V
• Pin counts ranging from 25‑ to 64‑pin
• Package options: LQFP, QFN, LGA, BGA, WLCSP (2.14 × 2.27 mm)
• Low‑power operation: 100 µA / MHz in active mode; 250 nA in software standby
• Integrated next‑generation capacitive touch sensor—no external components, reducing BOM cost
• On‑chip peripheral suite: 1.0 % precision internal oscillator, background data flash (1 M erase/program cycles), high‑current IO ports, temperature sensor
• Pin and peripheral compatibility with RA2L1 devices for seamless upgrade paths
• IEC60730 self‑test library and integrated safety functions for reliable operation
• AES cryptography accelerator, true random number generator (TRNG), and memory protection units for secure IoT deployments

The RA2E1 is supported by Renesas’ Flexible Software Package (FSP), featuring a comprehensive HAL driver and a GUI that accelerates development and eases migration from legacy 8/16‑bit MCUs. Designers also gain access to the extensive Arm partner ecosystem, streamlining time‑to‑market.

Renesas offers complementary analog and power solutions that pair with the RA2E1 to create turnkey systems for a variety of applications. The company’s “winning combinations” include core processors, low‑cost, low‑pin‑count, and low‑power features that align perfectly with the RA2E1’s capabilities. Additionally, RA2E1 kits support extended PMOD connectors, enabling modular IoT solutions with sensor and RF connectivity PMODs.