Winbond’s SpiStack Dual‑Die NOR+NAND Flash Powers NXP Layerscape LS1012A Development Board

Winbond Electronics has announced that its SpiStack dual‑die NOR+NAND code storage product is now integrated into NXP Semiconductors’ FRWY‑LS1012A board, which utilizes the Layerscape LS1012A communications processor. NXP selected the W25M161AW SpiStack for the board’s boot code and Linux operating system: the 16‑Mbit serial NOR Flash provides rapid system start‑up, while the 1‑Gbit serial NAND delivers high‑density storage for the OS.

The SpiStack’s stacked‑die construction, combined with Winbond’s software Chip‑Select feature, enables a fast‑boot NOR die and a high‑capacity NAND die to coexist in a single 8‑terminal WSON package. The package footprint measures 8 mm × 6 mm, maintaining a compact form factor with a standard pin‑out.

During the Flash Memory Summit, visitors could see demonstration systems that showcase the industry‑leading read performance of the W25N01JW High‑Performance Serial NAND. The chip achieves an 83 MB/s data‑transfer rate over a Quad Serial Peripheral Interface (QSPI), and a two‑chip dual‑quad interface pushes throughput to 166 MB/s.

This read speed—roughly four times faster than existing serial NAND devices—means the W25N01JW can replace traditional SPI NOR Flash in automotive applications such as instrument cluster storage and Center Information Display (CID) systems. As displays grow larger (7” and above) and graphics become more sophisticated, memory demands climb to 1 Gbit or more. Serial NAND offers lower unit cost and smaller board area per megabit at these capacities, making it an attractive choice for OEMs.