NXP Unveils Ultra‑Low‑Power Bluetooth MCUs with Integrated NFC for Smart Connectivity

NXP Semiconductors has introduced the QN9090 and QN9030 Bluetooth 5 system‑on‑chips (SoCs), offering hardware‑compatible options for 802.15.4, multiprotocol RF, and optional NFC technology. These new members of the QN series are engineered for intelligent, battery‑operated devices, delivering exceptionally low power consumption while featuring a high‑performance CPU, extensive peripheral set, and BLE mesh support.

The QN9090 and QN9030 run on an ARM Cortex‑M4 core clocked at 48 MHz and ship with up to 640 kB of on‑board flash and 152 kB of SRAM. This memory footprint enables sophisticated applications and secure, over‑the‑air (OTA) firmware updates.

Block diagram. (Source: NXP)

Variants QN9090T and QN9030T integrate an on‑chip NFC NTAG, enabling out‑of‑band wireless pairing and eliminating the need for an external power source for the NFC tag. This feature streamlines setup and enhances security across a broad spectrum of use cases.

Typical application circuit. (Source: NXP)

These SoCs open doors to diagnostics, device commissioning, and a range of connected applications—from personal health‑care wearables and fitness trackers to gaming peripherals, smart appliances, building automation, beacons, and mesh networks.

Key features include:

• Ultra‑low‑power consumption: 4.3 mA in receive mode and 7.3 mA in transmit mode at +0 dBm.
• Robust CPU and memory: 48 MHz ARM Cortex‑M4 core, 640 kB flash, and 152 kB SRAM.
• Advanced peripheral integration, including an NFC NTAG for seamless pairing.
• Comprehensive MCU capabilities: multiple low‑power modes, digital microphone interface with wake‑up on audio event, and a quad‑SPI NOR flash controller for high‑density storage.
• Standardized connectivity: 2.4 GHz Bluetooth Low Energy 5.0 transceiver with 2 Mbps data rate, up to eight concurrent connections, and antenna diversity.
• Integrated power amplifiers delivering up to +11 dBm transmit power for extended range.
• Wide operating temperature: –40 °C to 125 °C.

The QN9090/30 devices and the QN9090DK development board are now available through NXP and its distribution partners.

NXP QN9090DK development board for the QN9090. (Source: NXP)

The NXP MCUXpresso SDK for QN is fully compatible with the latest IAR and NXP MCUXpresso IDE toolchains. The complete MCUXpresso Suite accelerates BLE integration for existing NXP designs, while the NXP IoT Toolbox and Connectivity Test Tool provide end‑to‑end development support.