Renesas Electronics will unveil its next‑generation embedded solutions for endpoint intelligence at Embedded World 2019. The company will demonstrate how it is embedding smart capabilities into everyday spaces—smart living, automotive, infrastructure, and factories—to simplify life and drive innovat

Arrow Electronics has expanded its global secure provisioning service to include silicon from Cypress, Infineon, and Microchip, complementing the NXP Semiconductors Secure Elements already supported since the 2018 launch. This expansion enables rapid deployment of IoT edge nodes and gateways that in

Texas Instruments has launched two new Ethernet physical layer (PHY) transceivers, offering designers more compact and versatile options for both space‑constrained and time‑sensitive network (TSN) applications. The DP83825I is a low‑power 10/100‑Mbps PHY that packs into a 3 × 3 mm QFN package—44 % s

Mouser Electronics, in partnership with Microchip, announced the Ultimate Arduino Challenge at embedded world 2019. The contest, unveiled by Arduino co‑founder Massimo Banzi at the Mouser stand, invites engineers worldwide to develop Arduino‑based projects and submit them via the Supplyframe landing

Cypress Semiconductor has unveiled two low‑power, dual‑mode Bluetooth 5.0/LE microcontrollers—CYW20819 and CYW20820—designed to empower the next generation of Internet‑of‑Things (IoT) devices. These MCUs support full Bluetooth mesh networking while simultaneously maintaining classic Bluetooth audio

Infineon Technologies has introduced the iMOTION IMM100 series—smart IPM motor controllers that combine full hardware and software integration for BLDC drives up to 80 W, all without a heatsink. The new IC merges the motor controller and a 3‑phase inverter stage into a single, remarkably compact 12 

The Nanotec CL4‑E motor controller delivers exceptional performance in a sleek, compact package. Designed for both brushless DC and stepper motors, it can output up to 1,050 W of peak power while operating at a rated current of 6 A—no additional heat sinks required. Control is versatile: the CL4‑E s

Apacer will showcase a full range of storage solutions tailored for the AIoT/IoT market at Embedded World 2019. IoT devices demand uninterrupted operation and uncompromised data integrity, and Apacer’s newest products are engineered to meet those exacting standards while delivering remarkable cost‑e

Renesas Electronics extends its high‑integration Renesas Synergy S5 microcontroller series by adding the entry‑level S5D3 MCU Group. The four new S5D3 MCUs complement the mid‑range S5D5 and high‑end S5D9 groups, sharing core features: a 120 MHz Arm Cortex‑M4, advanced security, and general‑purpose p

STMicroelectronics’ STSAFE‑A100 Evaluation Pack expands the STM32 Nucleo ecosystem, enabling rapid secure‑element integration through reusable source code. Ideal for secure IoT devices, medical probes, IT accessories, and consumer products. The pack consists of the X‑NUCLEO‑STSA100 expansion board—h

SMART Modular Technologies has confirmed that it will provide long‑term support for a broad spectrum of its DDR3 legacy modules, including SO‑DIMMs, UDIMMs, VLP‑UDIMMs, Mini‑DIMMs, RDIMMs and LRDIMMs with capacities ranging from 8 GB to 32 GB. Manufacturers in sectors with extended product life cycl

Microchip has announced the launch of a new, compact imaging and video solution based on its PolarFire FPGA family. The kit delivers full‑resolution 4K performance in the smallest form factor while keeping power consumption at a minimum. FPGAs are uniquely positioned to handle the demanding computat

STMicroelectronics leverages its Arm Cortex expertise to extend its award‑winning STM32 MCU family into the realm of high‑performance, power‑efficient, open‑source software‑centric applications. The new STM32MP1 multicore microprocessor series combines compute and graphics acceleration, real‑time co

At Embedded World 2019, TDK showcased a suite of breakthrough products across its portfolio, highlighting the company’s leadership in embedded technologies. The event brought together TDK‑Micronas, TDK‑Lambda, TDK Europe, and InvenSense, each presenting solutions that span magnetic sensors, motor co

During the recent Embedded World trade show, Infineon Technologies unveiled its latest Embedded Power IC family—the TLE985x series. These AEC Q‑100‑qualified H‑bridge drivers deliver fully integrated motor‑control solutions for 2‑phase DC and single‑phase brushless‑DC motors, enabling automotive OEM

STMicroelectronics has embedded machine‑learning capabilities into its LSM6DSOX iNEMO sensor, elevating activity‑tracking accuracy while preserving battery life in mobile and wearable devices.Featuring a dedicated machine‑learning core, the sensor classifies motion data against known patterns, freei

ams will showcase a suite of industry‑first sensor technologies at MWC 2019 in Barcelona, highlighting how advanced sensing and 5G are reshaping mobile, automotive, robotics, and consumer electronics. Customers will experience breakthroughs across several domains: ultra‑high‑resolution 3D sensors fo

Embedded and automotive designers now have a new, power‑efficient solution from Microchip: the LAN7430 and LAN7431 PCIe 3.1 Ethernet bridges. Both devices integrate power, clocks, and an Ethernet PHY (LAN7430) or a Reduced Gigabit Media‑Independent Interface (LAN7431) for alternative PHYs and switch

Hyperstone has unveiled the X1, a new SATA III SSD controller engineered to meet stringent industrial demands. The X1 targets high‑reliability, low‑power SSDs—including M.2, U.2, CFast cards and eSSDs or discrete on‑board flash—by leveraging a cutting‑edge hyMap sub‑page flash translation layer. Thi

SMART Modular Technologies has unveiled the N200 SATA family—a line of high‑burst, low‑power SSDs designed for cost‑effective, reliable storage across a wide range of embedded and enterprise environments. Leveraging Triple‑Level Cell (TLC) 3D NAND, the N200 lineup includes mSATA (MO‑300), M.2 2242 a