Automotive electronics designers can now boost the number of displays in a vehicle while simplifying power‑management design, thanks to the MAX16923 4‑output display power IC with integrated watchdog timer from Maxim Integrated. By consolidating four or five discrete components into a single, highly

Silicon Labs has unveiled the EFR32BG22 (BG22) system‑on‑chip, a next‑generation Bluetooth 5.2 SoC engineered to meet the growing demand for battery‑powered, high‑volume Internet of Things (IoT) devices. Bluetooth Low Energy (BLE) has become the cornerstone of consumer‑facing IoT—from wearables and

Vayyar Imaging announced the world’s first 60‑GHz automotive‑grade MIMO radar‑on‑chip (ROC) at CES 2020. Building on its proven 79‑GHz reference design, this low‑cost solution empowers automakers to satisfy Euro NCAP and U.S. Hot Cars Act safety mandates while delivering advanced sensing capabilitie

The STM32WLE5 system‑on‑chip (SoC) from STMicroelectronics combines a low‑power STM32 microcontroller with a 48‑MHz ARM Cortex‑M4 core and a LoRa‑compliant radio. Designed for IoT, it delivers long‑range, low‑power connectivity across the entire unlicensed sub‑1 GHz band (150 MHz–960 MHz), ensuring

Chirp Microsystems’ CH‑201 MEMS sonar‑on‑chip time‑of‑flight (ToF) sensor extends the SmartSonic MEMS ultrasonic platform with a reliable 5‑meter range, making it ideal for room‑scale applications such as range finding, presence and proximity sensing, object detection/avoidance, and 3‑D position tra

Osram has launched its new Oslon Boost HM LED series, enabling ultra‑slim headlamp designs for modern vehicles. The Oslon Boost HM delivers an impressive 415 lm at 1.5 A from a minuscule 0.5 mm² chip, while the compact package—1.9 × 1.5 × 0.73 mm—makes it ideal for adaptive front‑lighting systems su

As robotic systems transition from research labs to commercial deployments across manufacturing, logistics, and services, it is essential to identify the remaining barriers that limit widespread adoption. Although both hardware and software have seen significant gains, rapid design evolution continu

Skyworks has expanded its front‑end module (FEM) portfolio to meet the growing demands of retail, carrier, and enterprise Wi‑Fi 6 deployments with the launch of the SKY85772‑11—a fully integrated 5‑GHz FEM. The module combines a 5‑GHz transmit/receive switch, a low‑noise amplifier (LNA) with bypass,

Embedded systems engineering, like the ocean, has persistent currents that shape its surface. While the core task—monitoring external events and responding—has remained constant, the tools and techniques we use to achieve it have transformed dramatically. Embedded’s flagship surveys from 1999, 2009

OmniVision Technologies has unveiled the OA805, a cutting‑edge video processor that delivers high‑efficiency video coding (HEVC) compression while achieving the lowest power consumption in the industry. Designed for battery‑operated security cameras and video doorbells, the OA805 makes 4K HEVC video

Microchip Technology introduces the PolarFire SoC FPGA, a defense‑grade platform that combines a hardened RISC‑V CPU cluster with FPGA fabric, enabling secure, real‑time Linux applications at the edge. The early‑access program (EAP) invites qualified developers to begin design work immediately. The

Tiny 3D Image Sensor Uses Time‑of‑Flight Technology Infineon Technologies AG, in partnership with pmdtechnologies AG, has introduced the industry’s smallest and most powerful 3D image sensor—REAL3. Unveiled at CES 2020, this single‑chip solution represents Infineons fifth‑generation time‑of‑flight (

LAS VEGAS — NXP Semiconductors unveiled the S32G, a single‑chip fusion of an automotive microprocessor and an enterprise network processor, according to Ray Cornyn, VP and GM of Vehicle Dynamics Products. The S32G serves as the central gateway for connected cars, delivering enterprise‑grade networki

NXP Semiconductors N.V. expands its EdgeVerse portfolio with the launch of its i.MX 8M Plus application processor. This is the first device in the i.MX family to integrate a dedicated neural processing unit (NPU) for advanced machine learning inference at the industrial and IoT edge. It also incorpo

In Las Vegas, Texas Instruments unveiled the TDA4VM ADAS and DRA829V gateway processors, built on its latest Jacinto platform to power mass‑market ADAS vehicles. The launch reflects a broader industry shift, with major OEMs revisiting their original push for fully autonomous vehicles. In a recent in

TDK Corp. has unveiled a new line of fault‑tolerant InvenSense inertial measurement units (IMUs) designed for demanding industrial settings. The ultra‑low‑noise IIM‑46234 and IIM‑46230 models feature integrated 6‑axis sensors that deliver precise measurements of linear acceleration and angular rate

Murata Electronics Americas, in partnership with Google, has introduced the industry’s smallest artificial intelligence (AI) module that also accelerates the algorithmic calculations required to run AI workloads. At the core of the new Coral Accelerator Module is Google’s Edge TPU ASIC, delivering h

OmniVision Technologies, Inc. has unveiled the first two models of its advanced automotive image sensor platform—the 8‑MP OX08A and OX08B. The OX08A delivers an industry‑leading 140‑dB high‑dynamic‑range (HDR) performance, while the pin‑out‑compatible OX08B sets a new benchmark for LED flicker mitig

As device connectivity expands, the risk of cyber attacks grows. At the core of secure hardware lies the root of trust (RoT). Although many manufacturers embed RoT in silicon, proprietary designs often lack transparency, forcing designers to place blind faith in unseen components. Enter OpenTitan—a

Lattice’s CrossLink‑NX family is engineered on the Nexus platform, merging a 28‑nm fully depleted silicon‑on‑insulator (FD‑SOI) process with a custom low‑power fabric. Designed for embedded vision and edge AI, the series delivers up to 75 % lower power than comparable FPGAs in the same class.The fla