Renesas Electronics Corp. has unveiled a family of five 8.2‑mm creepage photocouplers, positioning itself as the industry leader in producing the smallest isolation devices for industrial automation and solar inverters. The RV1S92xxA and RV1S22xxA models feature a 2.5‑mm package width, cutting PCB m

u‑blox, a global leader in wireless connectivity, has introduced the BMD‑380—a compact, high‑performance Bluetooth Low Energy 5.0 module that fits into the tightest of spaces. Measuring just 7.5 × 9.5 mm with its integrated ceramic antenna, the module delivers the long‑range capabilities of Bluetoot

LONDON – GreenWaves has announced GAP9, the next‑generation ultra‑low‑power AI accelerator that cuts power consumption by a factor of five compared to its predecessor, GAP8, while handling neural‑network workloads ten times larger. The chip delivers up to 50 GOPS at a total power draw of just 50 mW,

Key Advantages Compact size and reduced weight compared to traditional resolver solutions. Cost‑effective design that cuts bill‑of‑materials expenses. Highly configurable: supports on‑axis (end‑of‑shaft) and off‑axis (through‑shaft or side‑of‑shaft) topologies. Compatible with a wide range of mult

Hungary‑based AImotive, a leader in automotive AI solutions, has begun shipping its aiWare3P neural network (NN) inference engine intellectual property (IP) to key customers. The aiWare3P core, announced last year, delivers a purpose‑built accelerator for high‑resolution automotive vision and is ful

The company will also make its AI models for autonomous vehicles available to developers. At the company’s GPU Technology Conference (GTC) in Suzhou, China, Nvidia CEO Jensen Huang took to the stage to introduce Drive AGX Orin, the next generation SoC in the company’s automotive portfolio. Orin foll

Renesas has announced the industry‑first ASi‑5 ASSP, a fully compatible solution that builds on the success of the ASi‑3 standard while delivering unprecedented performance for industrial automation. The ASi‑5 platform achieves a cycle time of just 1.27 ms, supports cable lengths up to 200 m, and c

Microchip Technology Inc., a global leader in semiconductor solutions, has introduced a new family of Serial Peripheral Interface (SPI) EERAM memory devices that deliver up to 25 % cost savings compared to existing serial NVRAM products. The line expands the company’s portfolio to 64 Kbit through 1 

C&K has introduced the NanoT series, the world’s smallest tactile switch, engineered for next‑generation IoT devices such as smartwatches, health trackers, and hearing aids. The switches fit into a 2.2 × 1.70 × 1.65 mm package, giving designers the flexibility to add features or shrink PCB real est

A pin‑compatible derivative of ST’s STM32WB55 system‑on‑chip, the STM32WB50 Value Line wireless MCU supports Bluetooth 5.0, ZigBee 3.0, and OpenThread. The entry‑level dual‑core controller is based on an Arm Cortex‑M4 core (application processor) running at 64 MHz and an Arm Cortex‑M0+ core (networ

Renesas Electronics Corp. has unveiled the RX23W, a 32‑bit microcontroller that embeds Bluetooth 5.0 and Renesas’ Trusted Secure IP. The chip is engineered for IoT endpoints such as smart appliances, medical devices, and fitness gear, and it tackles common Bluetooth threats—eavesdropping, tampering,

The TS19501CB10H, designed by Taiwan Semiconductor, is an AEC‑Q100‑qualified dimmable LED controller featuring spread‑spectrum frequency modulation to suppress electromagnetic interference (EMI) in automotive lighting systems. Ideal for high‑beam and low‑beam headlights, daytime running lights, and

Boreas Technologies has expanded its award‑winning low‑power piezoelectric driver portfolio with the BOS1901CW, a wafer‑level chip‑scale (WLCSP) solution engineered for high‑definition haptic feedback in mobile and wearable consumer electronics. With a footprint of just 2.1 × 2.2 × 0.6 mm and power

STMicroelectronics has launched the STPMIC1, a power‑management IC that consolidates four high‑efficiency buck converters, a boost converter, and six low‑dropout regulators into a single 44‑lead WFQFN package. Designed as a companion to the STM32MP1 heterogeneous multicore microprocessor family, the

Bluetooth Low Energy (BLE) has become the backbone of the IoT ecosystem, enabling short‑range, low‑power wireless links that keep battery‑operated gadgets running for months or even years. The explosive growth of fitness trackers, smartwatches, and other wearables has accelerated adoption of BLE acr

In the medical and pharmaceutical sector, IoT is poised to transform how devices support clinicians and patients, elevating care quality and patient outcomes. Recent breakthroughs in system‑on‑chip (SoC) design have finally unlocked the potential of connected medical devices. These SoCs now integrat

Medical devices—from ultrasound systems and implantables to home glucose meters and fitness trackers—rely on microprocessors (MPUs) and microcontrollers (MCUs) that excel in execution speed, reliability, security, power efficiency, and connectivity. Many of these performance gains translate across a

According to the 2019 Embedded Market Study, published by EE Times and Embedded, emerging fields such as IoT, embedded vision, and machine learning are gaining traction in the development community—yet C and C++ still dominate the programming landscape for embedded developers. This annual survey, no

In an era of an aging global population and escalating environmental noise, safeguarding hearing health has never been more critical. Modern users demand hearing aids that are smaller, consume less power, and deliver crystal‑clear sound—an ideal fit for MEMS microphone technology. According to the W

Introducing the MAXREFDES220# Cuffless Blood Pressure Monitor Maxim Integrated’s MAXREFDES220# brings cuffless blood pressure measurement to the consumer market. By combining a high‑sensitivity optical sensor, a dedicated microcontroller hub, and a validated algorithm, the reference design delivers