TQ has unveiled its latest COM Express Compact Module, now powered by the most recent 8th‑generation Intel Core embedded processors. Building on the mobile‑processor variants showcased at Embedded World 2019, the new module expands the lineup to include the i7‑8665UE, i5‑8365UE, i3‑8145UE, and Celer

In tandem with Intel’s own release, SECO introduces a portfolio of solutions powered by Intel’s newest silicon: the 8th‑Generation Core U family (codenamed Whiskey Lake) and the 9th‑Generation Core H family (codenamed Coffee Lake Refresh). The 8th‑Gen Core U series delivers rich feature sets and imp

Kontron has expanded its COM Express Compact Type 6 portfolio with four 8th‑generation Intel QuadCore processors, each rated at 15 W. These new modules are the first in Kontron’s lineup to feature Intel Core i7‑8665UE, Core i5‑8365UE, Core i3‑8145UE, and Celeron 4305UE CPUs. The modules support up t

Designers looking for a compact, energy‑efficient Bluetooth 5.0 solution now have Panasonic’s PAN1762 module available through Mouser Electronics. Built on Toshiba’s TC35680 single‑chip controller, the module delivers the performance and flexibility required for modern IoT, beacon, and mesh network

Interface Concept introduces the IC‑FEP‑VPX3f, a cutting‑edge 3U VPX FPGA board that harnesses Xilinx’s Kintex UltraScale family to deliver unmatched performance for signal‑processing‑intensive embedded systems. It is the first VITA 66.5‑compliant 3U VPX board available today, featuring 12 full‑dupl

AAEON introduces the EPIC‑KBS9‑PUC bare‑bones embedded system, built on proven EPIC hardware to deliver the performance of 6th‑ and 7th‑generation Intel Core desktop processors in a space‑efficient chassis. The board has become a trusted foundation for robotics, point‑of‑sale terminals, and even cre

PORT expands its System‑on‑Module (SoM) portfolio with new IoT / Industry 4.0 solutions designed for Linux‑based real‑time applications. These compact modules bring PROFINET CCB and EtherNetIP (with optional EtherCAT and CANopen) onto a single board, delivering a cost‑effective and straightforward i

VadaTech has unveiled the FMC258, a cutting‑edge FPGA mezzanine module that complies with the VITA 57.4 (FMC+) standard. It integrates a single board‑mount optical assembly, delivering 12 full‑duplex transceivers with Clock Data Recovery (CDR). The front‑panel fiber I/O uses MTP/MPO connectors, supp

At Computex Taipei 2019, SECO, a global leader in embedded platforms, unveiled a portfolio of modular solutions that reinforce its cross‑platform vision. The lineup, built on cutting‑edge technologies and industry‑standard form factors—Qseven, COM Express and SMARC—demonstrates the company’s commitm

Axiomtek introduces the tBOX400‑510‑FL, a dual‑processor transport‑certified PC that integrates a 10‑port managed PoE switch, ideal for IP surveillance. The system is CE (Class A) and FCC‑certified, and meets E‑Mark, ISO 7637‑2, EN 50155, EN 50121‑3‑2, EN 45545‑2, IEC 60945 and DNV 2.4 standards.Pow

The rapid proliferation of Internet of Things devices is driving an unprecedented surge in data volume. By 2025, an estimated 150 billion machine sensors and IoT devices will continuously stream data that must be processed in real time. IDC forecasts global spending on AI systems to reach $35.8 bill

Since becoming a leading AIoT provider, Advantech has leveraged NVIDIA GPUs to power its cloud‑centric solutions and now extends that expertise to edge deployments.Built on NVIDIA’s Jetson platform, the company’s MIC‑710IVA, MIC‑720AI and MIC‑730AI systems deliver turnkey AI at the edge for smart‑ci

Lanner has announced the NCR‑1510, a fanless network appliance engineered for a wide temperature envelope of –40 °C to 70 °C. Built for SD‑WAN, uCPE, and edge security gateways, the device delivers reliable performance in harsh environments and critical infrastructure. Powered by an Intel Atom C3000

Vecow’s newest AI engine, the RCX‑1500 PEG Series Dual‑GPU Computing System, combines a workstation‑grade Intel Coffee Lake platform with dual NVIDIA GPUs—Tesla, Quadro, or GeForce—leveraging the latest Volta, Turing, and Pascal architectures. The dual‑GPU configuration doubles CUDA cores, deliverin

IBASE Technology is set to unveil its latest line of AIoT solutions powered by AMD Ryzen Embedded R1000 at the upcoming SPS IPC Drives Italia event. The centerpiece is the SI‑323‑N embedded system, built around the power‑efficient AMD Ryzen Embedded R1606G processor. This fanless platform delivers r

Acceed’s Nuvo‑7160GC is a rugged, GPU‑enabled industry PC that delivers up to 6 TFLOPS of compute power while supporting 120 W graphics cards such as the NVIDIA GeForce GTX 1050 Ti. Built on Intel’s 8th‑generation Coffee Lake CPUs, it offers flexible I/O – six gigabit Ethernet ports (four PoE‑capabl

Abaco Systems has unveiled the GVC1001, an ultra‑high‑performance graphics, vision, and AI evaluation platform built around NVIDIA’s latest Jetson AGX Xavier module. The module boasts a Volta GPU with 512 Tensor Cores, an 8‑core ARM CPU, and delivers up to 5.7 TFLOPS of sustained performance. Design

AAEON and Intel have teamed up to deliver the FWS‑8600 2U rackmount network appliance, built around the latest 2nd‑Generation Intel Xeon Scalable processors. It represents the most powerful network platform in AAEON’s portfolio to date. The appliance is engineered for demanding network workloads—inc

Peter Müller, Vice President of Product Center Boards & Modules at Kontron, explains the impetus behind the new Computer‑On‑Module standard, COM HPC. Data growth is unstoppable and the upcoming 5G wireless standard will accelerate it. Experts predict new digital business models that are only conceiv

Eurotech has introduced the CPU‑162‑23, a fanless COM Express Type‑7 module that marries Intel Xeon/Pentium D‑1500‑family power with rugged, industrial‑grade reliability. In a compact 125 × 95 mm Basic form factor, the module supports up to 16 cores and four DDR4 SO‑DIMM slots, delivering up to 64 G